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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate Description: Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum ...
... Value Manufacturer Sharp Microelectronics Product Category Linear Voltage Regulators Series - Packaging Cut Tape (CT) Package-Case SC-74A, SOT-753 Operating-Temperature -30°C ~ 80°C Mounting-Type Surface Mo...
Stable Bonding Solutions with High-performance Palladium Plated Copper Wire For Microelectronic Packaging What Is Palladium Coated Copper Bonding Wire? Palladium Coated Copper Bonding Wire is easier to bond tha...
Ultrathin High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ...
...packaging film provides reliable ESD protection during storage and transportation. This multi-layer film combines permanent anti-static properties with excellent clarity and mechanical strength, making it id...
Dowsil 7920LV High-Performance One-Part Thermal Die Attach in Microelectronics Packaging Basic Product Attributes DOWSIL 7920-LV Die Attach Adhesive is a one-part, black, thixotropic silicone adhesive with sel...
Application Of Molybdenum Copper Alloy As Microelectronic Material 1. Description Of Molybdenum Copper Alloy As Microelectronic Material: Molybdenum-copper alloy (MoCu a molybdenum-copper and tungsten-copper, b...
... lies solely in manufacturing welded components for businesses and industrial clients. From skyscraper steel frames to microelectronics connectors, we deliver welds that balance aerospace rigor, medical-grad...
...LBF package. Suitable for various surface mount applications, it offers reverse voltage ratings from 100 to 1000 V and a forward current of 1 A.Product Attributes Brand: Jingdao Microelectronics co.LTD Origi...
... mount applications.Product Attributes Brand: Jingdao Microelectronics Origin: Shandong, China Package Type: MBFTechnical Specifications Model Reverse Voltage (V) VRRM RMS Voltage (V) VRMS DC Blocking Voltag...
... of 1.2A, and high surge current capability. Designed for surface mount applications.Product Attributes Brand: Jingdao Microelectronics Origin: Shandong, China Package Type: ABS/LBFTechnical Specifications M...
...Metal Fiber Laser Cutting Machine Applicable Field Widely used for metalsheet processing, advertising trademark, advertising character, high/low voltage electrical cabinet, mechanism parts, kitchenware, cars...
W90cu10 W85cu15 Cuw Base Tosa Package Butterfly Package Receivers Transmitters Tunable Lasers Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prev...
... Wire for Microelectronics Parameter Specification Material Silver Core + Gold Plating Diameter 15 μm / 18 μm / 20 μm / 25 μm Gold Thickness 0.05 – 0.5 μm Tensile Strength Customizable Elongation ≥ 3–10% Sur...
...Palladium Copper Wire Anti-Oxidation PdCu Bonding Wire for Microelectronics Product Overview Palladium Coated Copper Bonding Wire (PdCu Wire) is designed for advanced semiconductor packaging applications. By...
... conductance and a fast switching speed. This diode is designed for reliability and efficiency in various electronic circuits. Product Attributes Brand: CHAOHE MICROELECTRONICS CO.,...
...Microelectronics (Shenzhen) Co., Ltd. These diodes offer high current capability and low forward voltage drop, making them suitable for various electronic applications. They are designed in a small outline p...