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Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal da...
...Microelectronics electronics IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chip and PCB board. Additionally,the IC substrate help protect the circuit, s...
...Packaged and Bulk Food metal detector Advantage Conveyor is a leading manufacturer of metal detector conveyors for use in packaging, food and other industrial applications. Our custom metal detector conveyor...
...Metal Detector For Small Size Package Auto-balance Conveyor Belt Metal Detector for Food Inspection Fanchi-tech Metal Detector has been widely applied in various industries like:meat& poultry processing, sea...
...Metal Bucket Unlined Paint Cans Metal Lid For 20l Metal Pail Metal pails made of tinplate - Metal packaging with UN-Approval for dangerous goods! Our versatile, robust Metal pails are best-suited as metal pa...
...Metal Detector Aluminum Foil Packaging Metal Detector About Shanan.pdf Product features and advantages: This metal detector is a magnetic induction metal detector, mainly used for metal foreign object detect...
... for battery applications. The space-saving SOT-26 package are attractive for "Pocket" and "Hand Held" applications. These rugged devices have both Thermal Shutdown, and Current Fold-back to prevent device f...
...Microelectronics STM32L0 Flash With 8 Timer STM32L031G6U ,STM32L031G6,STMicroelectronics,ARM Cortex M0+,10 Channel,8 Timer,STM32L0,Flash, ARM Microcontrollers - MCU Product Attribute Attribute Value Manufact...
...Microelectronics STM32L0 Flash With 8 Timer STM32L031G6U ,STM32L031G6,STMicroelectronics,ARM Cortex M0+,10 Channel,8 Timer,STM32L0,Flash, ARM Microcontrollers - MCU Product Attribute Attribute Value Manufact...
Product Overview The B5817WS and B5819WS are SOD-323 Plastic-Encapsulate Schottky Barrier Diodes from Parker Microelectronics (Shenzhen) Co., Ltd. They offer high current capability and low forward voltage drop...
.... Manufactured using advanced techniques like high-voltage planar process and triple diffusion, it features a fully plastic package and is RoHS compliant.Product Attributes Brand: Jilin Sino-microelectronics...
... with high voltage and current capabilities. Product Attributes Brand: Jilin Sino-microelectronics Co., Ltd Origin: China Certifications: Halogen-Free options available Technical Specifications Order Code Ma...
... Hz applications with resistive or inductive loads. For capacitive loads, current derating by 20% is recommended.Product Attributes Brand: Jingdao Microelectronics Origin: China Package Type: ABFTechnical Sp...
... for single-phase half-wave 60 Hz applications with resistive or inductive loads.Product Attributes Brand: Jingdao Microelectronics Origin: Shandong, China Package Type: MBFTechnical Specifications Model Rev...
... to 1000V and a forward current of 0.8A, it is ideal for various power supply and signal processing applications.Product Attributes Brand: Jingdao Microelectronics co.LTD...
...-passivated chip and available in the MBF package, it offers junction reverse voltage ratings from 100V to 1000V, making it suitable for various power supply and rectification circuits. Product Attributes Br...
... recovery time, and a range of reverse voltages from 100 to 800V.Product Attributes Brand: Jingdao Microelectronics () Package: MBF Terminals: Solderable per MIL-STD-750, Method 2026Technical Specifications ...
... current capability, making them suitable for various electronic circuits requiring efficient rectification and protection.Product Attributes Brand: Jingdao Microelectronics Origin:...
...MBF Package. Features include glass-passivated chip junction, high surge current capability, and suitability for surface mount applications. Available with reverse voltage ratings from 100V to 1000V.Product ...