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Total 36724 products for microelectronic metal packages Manufacture & Suppliers

Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal da...

Zhuzhou Jiabang Refractory Metal Co., Ltd
Hunan,China

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High TG Green Ceramic PCB Board OSP HASL Semiconductor Microelectronics

...Microelectronics Ceramic PCB Board Green Ceramic PCB Ceramic Base Material High TG Semiconductor And Microelectronic Green Ceramic PCB Board Ceramic PCB have good high-frequency and electrical performance, a...

Huashengxin Circuit Limited
Guangdong,China

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Microelectronic Packaging's Choice Ultra Fine 0.01mm Diameter Copper Palladium Alloy Wire And For Integrated Circuits

Microelectronic Packaging's Choice Ultra Fine 0.01mm diameter Copper Palladium Alloy Wire and for Integrated Circuits High-reliability CHR PCC wires have proprietary doping that cause the original Pd coatin...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

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CPC Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging

...Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electr...

Shaanxi Peakrise Metal Co.,Ltd
Shaanxi,China

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microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thi...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable...

Zhuzhou Jiabang Refractory Metal Co., Ltd
Hunan,China

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Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion charac...

Zhuzhou Jiabang Refractory Metal Co., Ltd
Hunan,China

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Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion character...

Zhuzhou Jiabang Refractory Metal Co., Ltd
Hunan,China

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Jingdao Microelectronics TB8S Bridge Rectifier with 800V Max DC Blocking Voltage and ABS LBF Package Design

... current capability, and a reverse voltage range from 100 to 1000 V.Product Attributes Brand: Jingdao Microelectronics Origin: Package: ABS/LBFTechnical Specifications Model Max. Repetitive Peak Reverse Volt...

Hefei Purple Horn E-Commerce Co., Ltd.
Anhui,China

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CPC Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging

...Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electr...

Shaanxi Peakrise Metal Co.,Ltd
Shaanxi,China

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Specialized Plating Processes Microelectronic Products Industrial Vacuum Ceramic Component With Metallization

Product Description: The Metalized Ceramic product is a versatile and high-quality material that boasts a variety of beneficial characteristics. With a high density, this Metalized Ceramic is known for its dura...

Wuxi Special Ceramic Electrical Co.,Ltd
Jiangsu,China

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Surface mount bridge rectifier Jingdao Microelectronics MB6FB with 600V reverse voltage and 0.5A forward current

... and rectification needs. The device offers a maximum reverse voltage of 600V and a forward current of 0.5A.Product Attributes Brand: Jingdao Microelectronics Origin: Shandong Jingdao Microelectronics Co., L...

Hefei Purple Horn E-Commerce Co., Ltd.
Anhui,China

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Custom Copper Molybdenum Microelectronic Material MoCu Alloy Electronic Package Sheet

Application Of Molybdenum Copper Alloy As Microelectronic Material 1. Description Of Molybdenum Copper Alloy As Microelectronic Material: Molybdenum-copper alloy (MoCu a molybdenum-copper and tungsten-copper, b...

Shaanxi Peakrise Metal Co.,Ltd
Shaanxi,China

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Non Volatile Microelectronic Integrated Circuit Chip

... with EEPROM and I²C memory interface, providing a voltage supply range from 2.5V to 5.5V. With a device package of 8-SOIC, this microelectronic chip offers a write cycle time of 5ms per word/page. It is an ...

Shenzhen Xinyuanpeng Technology Co., Ltd.
China

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2.8KW Advanced Packaging Equipment Visual Dispensing Machine For Dam Fill SiP Packaging

...Packaging The FS600 Series Inline Visual Dispensing Machine is an intelligent, cost-efficient solution developed specifically for Dam & Fill processes and SiP (System in Package) semiconductor packaging. Wit...

Changzhou Mingseal Robot Technology Co., Ltd.
Jiangsu,China

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Microelectronic Metal Packages

Total 36724 products for microelectronic metal packages Manufacture & Suppliers

Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

High TG Green Ceramic PCB Board OSP HASL Semiconductor Microelectronics

Microelectronic Packaging's Choice Ultra Fine 0.01mm Diameter Copper Palladium Alloy Wire And For Integrated Circuits

CPC Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging

microelectronics package substrate manufacture

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

Jingdao Microelectronics TB8S Bridge Rectifier with 800V Max DC Blocking Voltage and ABS LBF Package Design

CPC Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging

Specialized Plating Processes Microelectronic Products Industrial Vacuum Ceramic Component With Metallization

Surface mount bridge rectifier Jingdao Microelectronics MB6FB with 600V reverse voltage and 0.5A forward current

Custom Copper Molybdenum Microelectronic Material MoCu Alloy Electronic Package Sheet

Non Volatile Microelectronic Integrated Circuit Chip

2.8KW Advanced Packaging Equipment Visual Dispensing Machine For Dam Fill SiP Packaging