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...type 500um Ge wafers Ge wafer for microelectronic application N type, Sb doped Ge wafer N type,undoped Ge wafer P type,Ga doped Ge wafer Available size:2”-6” Available orientation: (100),(111),or custom spec...
Product Description: One of the key features of this product is its maximum temperature resistance of 1700. This makes it an ideal choice for applications that require high-temperature resistance, such as sili...
... several types of devices; the primary GaN devices are LEDs, laser diodes, power electronics, and RF devices. GaN is ideal for LEDs because of the direct ......
...Wafers,Ge optical plates Germanium substrates Application: germanium wafer used in production of semiconductor device, infrared ray optical device, sinking material of solar cell. Main Property Terms Product...
DFB wafer N-InP substrate epiwafer active layer InGaAlAs/InGaAsP 2 4 6 inch for gas sensor DFB wafer N-InP substrate epiwafer's brief A Distributed Feedback (DFB) wafer on an n-type Indium Phosphide (N-InP) sub...
Silicon Nitride Bonded Silicon Carbide Products(NSiC) NSiC Silicon Nitride Bonded Silicon Carbide Products are sort of structure ceramic material made bycasting the high-purity silicon carbide and silicon powde...
...Type A1001WV 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits From 2 pins to 24 pins Insulation O.D. 0.80mm(Max) Mating lock None Finish terminal Tin-plat...
...Type A1001WV 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits From 2 pins to 24 pins Insulation O.D. 0.80mm(Max) Mating lock None Finish terminal Tin-plat...
... Size 3/4 inch End Connection Wafer Working Pressure 300LB Medium Water, Oil, Gas, Air Body Material Carbon Steel Temp. of Medium -20℃~......
2” S Dopped GaP Semiconductor EPI Wafer N Type P Type 250um 300um Light-Emitting Diodes Description: Gallium phosphide (GaP) is a group Ⅲ-V compound. The appearance is orange-red transparent ......
Transparent Orange Undopped GaP Wafers P Type N Type 200um 350um 5G Light Emitting Description: Gallium Phosphide GaP, an important semiconductor of unique electrical properties as other III-V compound material...
GaP Semi-Insulated Wafers P Type N Type 400um 500um Green LED Red Green Light Emission Description: Gallium phosphide is a commonly used semiconductor material, which has the characteristics of high conductivit...
Mega Fit type ATX wafer header connector equivalent to Molex 5.7mm Pitch Housing with Terminal socket 6 Position pin LCP Gold Tin plating ......
...wafer connector SMT TYPE Description: 1.A1255 series is A1255WR-S-NP (Single row wafrer Mates with A1255-T series housing) 2,Wafer used materials:PA6T Pin: Phosphor Bronze /Gold-flash Solder tabs: Phosphor B...
...Wafer Connector Pitch 1.0mm 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits 12/16/20/30/40/50 positions Insulation O.D. 0.80mm(Max) Mating lock None Fini...
... terminal Tin-plated or gold-flash Mated housing A1001 series single row housing Mounting methods SMT type Wafer material Nylon 6T, UL94V-0 Cap Nylon 6T, UL94V-0 Pin material Phosphor bronze or...
...wafer connector SMT TYPE Description: 1.A1255 series is A1255WR-S-NP (Single row wafrer Mates with A1255-T series housing) 2,Wafer used materials:PA6T Pin: Phosphor Bronze /Gold-flash Solder tabs: Phosphor B...
... terminal Tin-plated or gold-flash Mated housing A1001 series single row housing Mounting methods SMT type Wafer material Nylon 6T, UL94V-0 Cap Nylon 6T, UL94V-0 Pin material Phosphor bronze or...
...Wafer Connector Pitch 1.0mm 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits 12/16/20/30/40/50 positions Insulation O.D. 0.80mm(Max) Mating lock None Fini...
...offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used ...