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... size,Battery PCM Thermal energy storage phase changing materials heat sink for cooling Extends Cycle Life is a solid PCM for battery thermal management that leverages the unique properties of Phase Change M...
...Phase Changing Materials For Microprocessors Chipsets TIC®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation probl...
...Phase Changing Materials For Microprocessors Chipsets TIC®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation probl...
Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply The TIC800K Series products is a high thermal conduction and ......
...Phase Changing Materials For Laptop Computer TIC®800K-A1 Series this series is a high-performance and high-cost-utilization thermal interface material. lts unique grain directionality and plate structure all...
...Phase Changing Materials For Microprocessors Chipsets TIC®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation probl...
0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface m...
Low Melting Materials Customized High Quality Phase Change Material For Notebook TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the m...
Low Melting Point Thermal Interface Material Phase Changing Materials for Notebook Desktop Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry,...
Computer Serves Thermal Phase Changing Materials / Heat Sensitive Materials The TIC™808Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling t...
...material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide ......
...Phase Change Material For Gap Filling Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sal...
... superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, ......
... superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, ......
...-oriented structure that enables precise conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C,...
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, fil...
2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, fill...
Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface ...
Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, f...
5.0 W/mK Low Thermal Resistance Pink Phase Changing Materials For IGBTs TIC808P series is low melting point thermal interface material. At 50, TIC808P series begins to soften and flow, filling the microscopi...