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...Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic ir...
...Phase Change Interface Material For Notebook The TIC™808P Series is low melting point thermal interface material. At 50℃, The TIC™808P Series begins to soften and flow, filling the microscopic irregularities...
...Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the ...
...Phase Change Material For Notebook TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the therm...
...Phase Change for High Power LED Lights TIC™805G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the t...
...Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopi...
...phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC™803P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the mic...
... the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™808P series is a flexible solid at room temperature and freest...
...Phase Change Materials Interface Pad Pink Low Resistance For LED Power Supply The TIC™805P Series is low melting point thermal interface material. At 50℃, The TIC™805P Series begins to soften and flow, filli...
... the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™810P Series is a flexible solid at room temperature and fr...
...Phase Changing Materials TIC™805Y with 0.024℃-in² / W The TIC™805Y Series is low melting point thermal interface material. At 50℃, The TIC™805Y Series begins to soften and flow, filling the microscopic irreg...
...Phase Changing Materials / Heat Sensitive Materials The TIC™808Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregu...
...Phase Changing Materials Heat sink Thermal Sheet The TIC™810Y Series is low melting point thermal interface material. At 50℃, The TIC™810Y Series begins to soften and flow, filling the microscopic irregulari...
...phase changing materials The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins to soften and flow, filling the microscopic irregularities of both the thermal soluti...
...phase change materials For IGBTs TIC800P series is low melting point thermal interface material. At 50℃, TIC800P series begins to soften and flow, filling the microscopic irregularities of both the thermal s...
...Phase Change Material For Communications Equipment And Wireless Stations The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling th...
...phase decanter centrifuge machine for oil obtaining from cooked cartilage and adipose tissue Product description: Decanter centrifuge is a mechanical equipment which utilize the principle of centrifugal and ...
...Phase Change Material Thermal Conductive Silicone Insulation Pad TIC™800P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irr...
Phase change material CPU cooling TIC™810P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal so...
...Phase Change Material PCM TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal sol...