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...Spreader , Microelectronic Packaging Tungsten Copper Submount Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper...
... characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composit...
..., but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the co...
...Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different mate...
...Spreader Description: Cu-Mo is suitable for rolling and pressing processes. Thermal expansion and thermal conductivity are adjustable with this material.Cu-Mo is much lighter than Cu-W, so that it is more su...
... CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages. Advantages: High thermal conductivity Excellent...
...Spreaders And Packaging Components For RF And Microwave Amplifiers Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity ca...
...Paste is formulated to provide excellent flow properties, ensuring uniform coverage and optimal adhesion between the brazing surfaces. Its unique composition of silver, copper, and indium contributes to its ...
... paste gel One-part pre-curing type Silicone thermal conductivity complex Product Features: High thermal conductivity 4W/m∙K Very small BLT and very low thermal resistance Soft adhesion and self-adhesive pro...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 6.2 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...