30Khz Low Power Ultrasonic Atomization Spray Scattering Nozzles for
Semiconductor Photoresist Coating
Description:
Scattering nozzles use low-pressure air/gas to generate uniform and
wide spray patterns, with each nozzle reaching a maximum of 9.8
inches (25 centimeters) depending on the distance from the
substrate. The speed of the air flow is controllable to allow low
or high impact of the atomized spray on the product or substrate.
Using multiple nozzles in series can achieve infinite width.
Scattering nozzle design is used for wide patterns with high
repeatability in slender nozzles.
Parameters:
| Model | FSW-3002-L |
| Name | 30Khz Scattering Ultrasonic Nozzle Atomization |
| Frequency | 30Khz |
| Atomized particle size range(μm) | 15-40 |
| Spray width(mm) | 40-80 |
| Spray flow(ml/min) | 0.5-20 |
| Spray height(mm) | 30-80 |
| Liquid viscosity (cps) | <30 |
| Particle size (μm) | <15 |
| Diversion pressure (Mpa) | <0.05 |
| Application | Suitable for Photoresist coatings on semiconductor chips |
Ultrasonic spraying technology has the following advantages over
traditional spraying technology in terms of coating quality:
1. Uniformity and consistency: ultrasonic spraying can produce tiny
and even spray particles, so that the coating can be evenly
distributed on the target surface, thus achieving the uniformity
and consistency of the coating. In contrast, traditional spraying
techniques may result in uneven coating thickness or spray marks.
2. Compactness and adhesion: because the spray particles produced
by ultrasonic spraying are small and uniform, they can better cover
the target surface and form a more dense coating. This improves the
adhesion and durability of the coating, reducing the risk of
coating detachment or peeling.
3. Control of coating thickness: ultrasonic spraying technology can
achieve accurate control of coating thickness by adjusting the size
of spray particles and spraying parameters. This precision makes
ultrasonic spraying technology suitable for application scenarios
that require specific coating thickness, such as thin film coatings
or areas with high coating thickness requirements.
4. Reduce solvent evaporation: Ultrasonic spraying is usually
carried out at lower pressures, which helps to reduce solvent
evaporation in coatings. In contrast, traditional spraying
techniques may require higher spraying pressure, leading to faster
solvent evaporation and potentially affecting the quality and
performance of coatings.
5. Suitable for special coatings: Ultrasonic spraying technology is
suitable for various types of coatings, including high viscosity
liquids, high solid content liquids, nanoparticle suspensions, etc.
This makes ultrasonic spraying technology advantageous in the
application of special coatings, allowing for higher quality
coatings.
It should be noted that coating quality is not only related to
spraying technology, but also influenced by various factors, such
as coating quality, surface pretreatment, optimization of spraying
parameters, etc. Therefore, when choosing spraying technology, it
is necessary to comprehensively consider multiple factors and
evaluate and choose according to specific application requirements.
30Khz Low Power Ultrasonic Atomization Spray Scattering Nozzles for
Semiconductor Photoresist Coating
