Fan Out 2.5D Chip Automated Glue Dispenser On Wafer On Substrate Wafer Level Dispensing Machine

Fan-Out 2.5D Chip on Wafer on Substrate Wafer-Level Dispensing Machine

The SS101 Wafer-Level Dispensing Machine is an advanced underfill dispensing solution engineered for the demanding requirements of Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) processes. Equipped with dedicated underfill valves, the SS101 precisely dispenses fine volumes for small bump and narrow pitch applications, ensuring optimal flow without voids or bridging. Its programmable dispensing path and real-time temperature compensation effectively minimize thermal fluctuations during dispensing — a crucial factor for achieving uniform underfill in delicate 2.5D stacked chip structures.

An integrated weighing calibration module and whole-process video monitoring enable precise glue weight control and easy traceability, while ESD protection complies fully with IEC and ANSI standards to safeguard sensitive wafers throughout the process.

Core Advantages

• Perfect for Small Bump, Tight Pitch & Low SOH: Support ultra-small bump dimensions and low stand-off height encapsulation without overflow or air gaps.

• Dedicated Underfill Valve Control: Custom-designed underfill dispensing valve ensures stable, consistent flow with minimal clogging and bubble formation.

• Stable Thermal Management: Integrated preheating, chuck table with uniform heating, and automatic temperature correction prevent thermal stress and resin defects.

• Programmable Dispensing Path: Flexible path editing supports complex wafer-level layouts and variable fill depths, improving efficiency and precision.

Application Areas

✔ Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS)
✔ RDL First FoWLP (Fan-Out Wafer-Level Packaging)
✔ High-Density ASIC/CPU/GPU Underfill
✔ Advanced Packaging for High-Performance Computing
✔ Small Bump Fine-Pitch Wafer Encapsulation

Technical Specifications

FAQ

Q1: How does the SS101 handle small bumps and tight pitches?
A: The system’s dedicated underfill valves, high-resolution vision, and precise motion ensure exact glue placement for bumps, minimizing voids and resin spread.

Q2: What makes its thermal management unique?
A: The integrated chuck table and preheating system deliver uniform wafer temperature, while real-time feedback auto-corrects heat drift, preventing thermal stress and warping.

Q3: Does it support AMHS integration?
A: Yes — the PC101 EFEM module connects seamlessly with AMHS robots for automated wafer handling and improved production efficiency.

Q4: Is the SS101 suitable for RDL First processes like FoPoP and CoWoS?
A: Absolutely — it’s purpose-built for high-end RDL First FoWLP lines, including CoWoS and FoPoP, where underfill precision is mission-critical.

About Mingseal

Mingseal is a trusted global manufacturer of advanced inline dispensing and precision automation solutions. With a strong focus on semiconductor, MEMS, optical, and microelectronics applications, we deliver high-stability equipment and localized technical support to help manufacturers worldwide achieve higher yield, greater efficiency, and smarter production lines.

Contact us today to discuss your wafer-level underfill needs and experience the Mingseal difference.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.