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Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support

    Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers
     
    Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers
    • Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers
    • Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers
    • Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers
    • Buy cheap Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support from wholesalers

    Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support

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    Brand Name : Mingseal
    Model Number : GS600SS
    Certification : ISO CE
    Price : $28000-$150000 / pcs
    Payment Terms : L/C,D/A,D/P,T/T,Western Union
    Delivery Time : 5-60 Days
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    Warped Chip Advanced Packaging Equipment Flux Jetting Dispenser For Flux Support

    Advanced Flux Jetting Dispenser for Warped Chip Flux Support


    The GS600 series is a next-generation inline flux jetting system designed to solve one of the most demanding challenges in semiconductor assembly: flux application on highly warped chips mounted on substrates.

    When working with chips prone to significant warpage, maintaining consistent flux coverage is critical to avoid bonding failures and achieve defect-free soldering. The GS600 series meets this need with a combination of high-speed jetting, exceptional positional accuracy, and advanced process monitoring.

    Whether used as a standalone station or integrated inline with SMT, DB, or advanced packaging lines, the GS600SS provides the performance and stability manufacturers need for warped chip soldering and underfill processes.



    Core Advantages


    • Reliable flux jetting for warped chips: Maintains uniform application even on substrates with significant warpage.

    • No splatter, precise targeting: Jetting valve technology ensures clean flux lines and prevents contamination.

    • Inline glue weight monitoring: Automated weight checks with alarms safeguard quality and consistency.

    • Self-cleaning jetting head: Reduces downtime and maintains spray performance during extended operations.

    • Flexible integration: Compatible with various SMT and semiconductor packaging workflows.



    Typical Applications


    Flux jetting for highly warped chip solder support
    Pre-soldering flux coating on uneven substrates
    Supplemental flux application before chip bonding
    Advanced semiconductor assembly where high-precision flux distribution is critical


    Technical Specifications

    Cleanliness LevelCleanliness of working areaClass 100
    Motion SystemMax. Dispensing Range (X*Y)325*160mm
    Repeatability (3sigma)X/Y ≤ ±3 μ m Z ≤ ±5 μm
    Positioning Accuracy (3sigma)X/Y ≤ ±10 μ m Z ≤ ±15 μm
    Max. SpeedX/Y:1000mm/s Z: 500mm/s
    Max. AccelerationX/Y:1g, Z:0.5g
    Track SystemTrack FormSingle-track conveying, 3-segment lifting, mid-section operational-lifting mode
    Track Parallelism<0.1mm (max-min width variation)
    Height Adjustment Range890-960mm
    Width Adjustment Range60-160mm
    Max. Convey Speed300mm/s
    Max. Carrier Load3kg
    Lifting MethodTrack-lifting (fixture remains stationary)
    Track Suction CapacityCover ±2mm warping of substrates
    Heated Bottom-plateContact-type Heating (Room temperature -150℃), with Vacuum Suction
    Max. Vacuum Suction Pressure-70KPa - -40KPa
    General ConditionDimension (W*D*H)1401*1200*2112mm
    Environmental Temperature23±5℃
    Environmental Humidity30-70%

    Q&A


    Q1: What makes the GS600 series better for indium sheet flux spraying?
    A: Its atomization system ensures flux is applied evenly with a fine 5μm layer, eliminating splatter and maintaining surface cleanliness.


    Q2: Can it handle continuous high-volume runs?
    A: Yes! The automatic glue weight verification and nozzle self-cleaning ensure long, stable production without manual intervention.


    Q3: Is it easy to integrate with other equipment?
    A: Absolutely — the GS600SS supports SMEMA interfaces and works seamlessly with SMT, DB, and other semiconductor packaging lines.


    Q4: What type of spray valve is recommended?
    A: The system can be configured with high-precision spray valves like the KAS1000, designed for tight control and minimal overspray in critical flux applications.


    About Mingseal


    Mingseal is a trusted name in high-end dispensing solutions for semiconductor, MEMS, optical module, and advanced packaging industries. With years of specialized R&D and deep process experience, we help manufacturers worldwide achieve higher yields, tighter process control, and greater line efficiency with precision dispensing and spraying technologies.
    Looking for a smarter way to handle your indium sheet flux spraying? Partner with Mingseal to secure your next-generation production edge.


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