SiC diamond wire cutting machine Precision guidance SiC crystal rod
cutting
Silicon carbide cutter is a kind of equipment specially used for
cutting silicon carbide (SiC) ingot, mainly used to divide large
size silicon carbide ingot into smaller chunks or segments for
subsequent processing. Silicon carbide as a kind of high hardness,
high wear resistant material, its cutting needs special equipment
and technology, silicon carbide cutter is designed for this
efficient tool.
Characteristics of SiC diamond wire cutter
· High cutting efficiency: Using diamond cutting wheel or line saw,
can quickly cut high hardness silicon carbide ingot.
· High stability: The equipment structure is stable, suitable for
long-term continuous work.
· Low pollution: Use coolant to reduce dust and keep the working
environment clean.
· Easy operation: Equipped with automatic control system, easy
operation and high cutting precision.
Technical specifications
| Specification | Details |
| Dimensions (L × W × H) | 2500x2300x2500 or customize |
| Processing material size range | 4, 6, 8, 10, 12 inches of silicon carbide |
| Surface roughness | Ra≤0.3u |
| Average cutting speed | 0.3mm/min |
| Weight | 5.5t |
| Cutting process setting steps | ≤30 steps |
| Equipment noise | ≤80 dB |
| Steel wire tension | 0~110N(0.25 wire tension is 45N) |
| Steel wire speed | 0~30m/S |
| Total power | 50kw |
| Diamond wire diameter | ≥0.18mm |
| End flatness | ≤0.05mm |
| Cutting and breaking rate | ≤1%(except for human reasons, silicon material, line, maintenance
and other reasons) |
Design advantage
1. The two active cutting wheels of the cutting system are driven
by motors to cut
High efficiency, good cutting quality;
2. Single machine to achieve multi-specification silicon carbide
end processing and circular cutting function;
3. Device operation interface The device is simple and easy to
operate;
4. Fully closed external protection, cutting process to avoid dust
pollution, low noise.
The effect of SiC diamond wire cutter
The silicon carbide cutter can efficiently and accurately cut large
size SiC ingot into standard crystal blocks, the cutting accuracy
can reach ±0.1mm, and the section flatness is controlled within
5μm. This high-precision cutting ensures a 15-20% increase in
material utilization during subsequent slicing operations, while
reducing edge losses during wafer preparation. Using diamond wire
saw technology, cutting loss is only 0.3-0.5mm, compared with the
traditional cutting method to save more than 20% of raw material
costs. The cut wafers can be directly used to prepare 4- to 8-inch
SiC wafers to meet the demanding substrate material requirements of
power semiconductor devices such as MOSFET and SBD.
ZMSH service
We provide silicon carbide cutting machine sales, leasing and
supporting technical services, including equipment selection
guidance, process parameter optimization, operator training and
after-sales maintenance support, while providing customized cutting
solutions according to customer needs.
Q&A
