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... system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for p...
... system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for p...
...n green oil PCB. PCB uses resin plug hole. This process is often due to BGA parts, because traditional BGA may make VIA between PAD and PAD to the back of the wiring, but if the BGA is too dense When VIA can...
... soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air...
...fine pitch, QFP, BGA, μBGA, CBGA Advanced SMT assembly Automated insertion of PTH (axial, radial, dip) Cleanable, aqueous and lead-free processing RF manufacturing expertise Peripheral process capabilities P...
...BGA part Able to process 0.35 pitch micro BGA, AQFN, QFP, QFN, & AQFN (advanced quad flat no-leads) Quantity Up to 100,000 pieces quick SMT machine per day Quality check AIO and X-RAY automatic check Clean r...
...BGA part Able to process 0.35 pitch micro BGA, AQFN, QFP, QFN, & AQFN (advanced quad flat no-leads) Quantity Up to 100,000 pieces quick SMT machine per day Quality check AIO and X-RAY automatic check Clean r...
... cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working ...
Proprietary 80 / 90 kV source with submicron focal spot size X Ray Machine FEATURES: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion con...
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standar...
AX7900 Automatic X-ray mapping inspection for IC electronics components inner quality and counterfeit checking Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement ...
...-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared em...
...) package, and is suitable for applications such as telecommunication, storage, and data processing. Features: • 324-pin BGA package • 28K logic elements • Up to 18,432 Kbits of embedded memory • Up to 576Kb...
...Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA b...
...Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA b...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT machine(for...
...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pi...
...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pi...
...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pi...
...Assembly Side Single/Double Process SMT Min Size 10mm * 10mm THT Max Size 410mm * 350mm Punch Thickness 0.38mm ~ 6.00mm In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pi...