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... table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. de...
... shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the on...
...BGA / chip on chop analysis Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-R...
... • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • ......
... • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area ...
...BGA QFN Soldering void check Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tu...
...BGA inspection of Electronic Components FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls ...
...BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z ax...
...BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z ax...
...BGA-484 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance ...
... dispensing machine developed by Mingseal specifically for SMT industry PCBA processes. It is ideal for SMT underfill, BGA/CSP chip encapsulation, PCB solder paste jetting, and various high-precision dispens...
... Panel size 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special proces...
... 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only ...
...*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for ...
...*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for ...
... Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for protot...
... Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for protot...
... Panel size 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special proces...
...*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for ...
... Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for protot...