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Total 536 products for bga reballing process Manufacture & Suppliers

EMMC 5.1 For Tablets 256GB 128GB 64GB EMMC 5.1 For Smart phones

... and connection process.EMMC (Embedded MultiMedia Card) is an embedded non-volatile storage solution. It integrates NAND flash chips and flash controllers into a small BGA (Ball Grid Array) package, providin...

China Chips Star Semiconductor Co., Ltd.
China

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76.2mm Integral ADT Dicing Blades For Optical Glass Cutting

...Dicing Wheel or Saw Blade Sample blade specification: 76.2*32*0.35mm High performace in BGA processing We use resin powder to increase the flexibility of cutting blades in order to supply high performace of ...

Shaanxi Tongyu Industry And Trade Co,.Ltd
China

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High Density Interconnect PCB Board With Lamp Socket Support LED Screen HDI Prototype 4L 1+N+1 Quickturn

...BGA. These features make the board suitable for devices that require high-density interconnects with tight spaces, such as smartphones, tablets, and other handheld devices. The thickness of the board ranges ...

LT CIRCUIT CO.,LTD.
China

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Customized EMS PCB Assembly / Electronics PCB Components Assembly

...High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD work...

Huaswin Electronics Co.,Limited
China

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Power Controller PCB Hard Gold Plating PCB with SMT / THT Assembly

...High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD work...

Huaswin Electronics Co.,Limited
China

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Blue Contract PCB Assembly Quick Turn PCB Prototype ISO9001-2008

... design and plastic injection molding 6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 7. IC programming Quality Assurance: Our Quality processe...

Huaswin Electronics Co.,Limited
China

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Fine Pitch PCB Assembly Services PCBA Automatic Optical Inspection

...High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD work...

Huaswin Electronics Co.,Limited
China

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Multilayer SMT Circuit Board Assembly Through-hole PCB Manufacturers

...medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD workmanship operation ...

Huaswin Electronics Co.,Limited
China

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Turnkey Printed Circuit Boards Design Fabrication And Assembly

... design and plastic injection molding 6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 7. IC programming Quality Assurance: Our Quality processe...

Huaswin Electronics Co.,Limited
China

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Printed Circuit Board Multilayer PCB FPC Board Flexible PCB Immersion Gold Yellow

... Service. (FR-4,HI-TG,Aluminum,FPC,TEFLON,CEM-1 ) FPC,PCB Copy Service. PCB Assembly Service. (SMT, BGA, DIP) IC program with HEX file. PCBA Housing assembly serivce. PCBA Final Functional Testing....

Huaswin Electronics Co.,Limited
China

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High Precision Custom PCB Boards With 2 Mil Line Width And Space 0.5 OZ 4 Layer

...Board thickness: 1.0mm Copper THK: 0.5oz Min line space and width: 2mil BGA: YES Base material: FR4 PCB Capabilities By Process: Front-end CAM -Fully automated Tooling System Imaging-Laser Direct Imaging -Tr...

Shenzhen Xinchenger Electronic Co.,Ltd
Guangdong,China

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Quick Turn SMT PCB Assembly THT Multilayer SMT Circuit Board Assembly

...medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD workmanship operation ...

Huaswin Electronics Co.,Limited
China

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Lead Free HASL Turnkey PCB Assembly Heavy Copper Reliability PCB ROHS

...High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD work...

Huaswin Electronics Co.,Limited
China

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Quick Prototype Through Hole PCB Assembly Services OEM PCBA Potting

...High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD work...

Huaswin Electronics Co.,Limited
China

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Turnkey PCB assembly and PCBA Factory Contract Manufacturing Service at UNIQUE UQPCBA002

... PCB Assembly Fit 0402,PLCC,BGA ISO9001 factory PCB Assembly One Stop PCB Assembly factory /PCBA Contract Manufacturing Service in China • IPC-610-D inpection standard for PCB Assembly process from component...

Dongguan Luphi Electronics Technology Co., Ltd.
Guangdong,China

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LF HASL PCB Full Turnkey PCB Assembly Services with ISO approval

... design and plastic injection molding 6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 7. IC programming Quality Assurance: Our Quality processe...

Huaswin Electronics Co.,Limited
China

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Flexible Multilayer Printed Circuit Board Assembly for Touch Screen controller PCBA board

...: Fast prototyping High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E a...

Huaswin Electronics Co.,Limited
China

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Lead Free HASL Through Hole PCB Circuit Board Assembly Services with ICT testing

...medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD workmanship operation ...

Huaswin Electronics Co.,Limited
China

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Shenzhen Through Hole PCB Assembly Lead Free HASL White Silkscreen With ICT Testing

...: Fast prototyping High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E a...

Huaswin Electronics Co.,Limited
China

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Bga Reballing Process

Total 536 products for bga reballing process Manufacture & Suppliers