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... Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for prototype) 2. Product ...
... Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only for protot...
... 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special process POP(only ...
... Panel size 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB thickness 0.2-3.5mm, FPC, Rigid-flex Most Precision process 0201 Special proces...
...provide one-stop service: 1. PCB circuit boards+Assembly 2. E-test. 3. Electronic components purchasing. 4. PCB assembly: available on SMT, BGA, DIP. 5. PCBA function test. 6. Enclosure assembly. * PCBA Proc...
...:0.01±0.008” 8layer:0.01±0.008 PCB design, PCB +BOM clone, PCB assembly(SMT, DIP...) * PCBA Processing Capacity: Processing Service One Stop PCB Assembly service, include components &...
...provide one-stop service: 1. PCB circuit boards+Assembly 2. E-test. 3. Electronic components purchasing. 4. PCB assembly: available on SMT, BGA, DIP. 5. PCBA function test. 6. Enclosure assembly. * PCBA Proc...
... system – with automated batch inspection – offering high-precision imaging for BGA solder voids and PCB through-holes Key Advantages Programmable inspection processes to enable automated batch inspection Ne...
... as carrier tape and protective substrate during the dicing and grinding process. UV tape is mainly composed of release film, acrylic adhesive and base film. Main application Semiconductor: Dicing of various...
...reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infra...
Hot air + Infrared 2500w Reflow Oven CHMRO-420 300*300mm BGA SMD SMT Rework Sation Heating Station 220v CHMRO-420 Reflow Oven: Soldering max area: 300*300mm Soldering way: Hot air + IR mix Rated power: 2500W Pr...
... main features 1.The temperature difference it is extremely small between BGA bottom and PCB board, which is most in line with the strict requirements of lead-free process, especially for lead-free products ...
.... Our SMT assembly facility service is perfect for clients who need high quality components, including passive, active, BGA, QFN, SOP, SOIC, etc. For our service, we use the latest SMT assembly process to gu...
... services. Our state-of-the-art equipment and experienced staff ensure that all components, such as passive, active, BGA, QFN, SOP, and SOIC, are mounted correctly and accurately. Our SMT assembly process in...
...BGA package. It is designed for high-performance applications and offers a wide range of features, including a high-speed ARM Cortex-M3 processor, advanced analog and digital peripherals, and a wide range of...
.... Our services cover the entire SMT assembly process, from PCB design and layout to component sourcing and assembly. We specialize in THD (Thru-Hole Device) assembly, with parts ranging from fine pitch to 8 ...
...BGA We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stabl...
...BGA We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stabl...
...BGA We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stabl...
... into a single package, simplifying the design and connection process. 2. Packaging form: Usually provided in BGA (Ball Grid Array) packaging form, with a set of spherical solder balls at the bottom for conn...