CUF FCBGA Advanced Packaging Equipment Underfill Dispensing Solution FCCSP SiP

Advanced Underfill Dispensing Solution for CUF Application in FCBGA FCCSP SiP

The GS600 series Automatic Underfill Dispensing Machine is an industry-grade solution engineered for high-precision CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow rates and consistent glue patterns, even with high-viscosity epoxy and underfill adhesives. Automatic platform loading and unloading modules, plus inline visual inspection, complete the fully automated workflow, keeping yields high and manual intervention minimal.

Core Advantages

• Exceptional underfill accuracy: Piezoelectric CUF jetting module with micro-gram precision.
• Consistent quality: Closed-loop glue temperature management maintains stable flow.
• No downtime surprises: Triple low-level detection ensures glue supply stays continuous.
• Controlled heating: Vacuum fixture plus real-time heat feedback guarantees uniform substrate preheat.
• Automated operation: Fully automated wafer or substrate loading/unloading with integrated visual inspection to detect flaws before or after the process.
• Dual-track press-down structure: Preserves workpiece flatness for perfect underfill gap control.

Typical Applications

✔ FCBGA CUF Application
✔ FCCSP CUF Application
✔ SiP CUF Application

Core Modules

CUF Special Piezoelectric Jetting System
Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence

Triple Low-level Alarm Module
Capacitive detection + photoelectric detection + system weighing to avoid poor batch operation caused by lack of glue

Process Module
Automatic glue residue cleaning, automatic weighing and glue amount calibration function.

Vacuum Adsorption Heating Fixture
The temperature difference of the whole fixture surface ≤ ±1.5°C

Real-time temperature and compensation to avoid poor operation caused by product temperature variation during operation.

Platform-Type Loading & Unloading System
Automatic sorting of feed sequenceCompletion of operation within Plasma time limit

Friendly human-machine interface design

Visual system
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects

FAQ

Q1: What type of adhesives are compatible with the GS600 series?
A: The machine supports a wide range of underfill epoxies, high-viscosity adhesives (up to 200,000cps), and other advanced formulations needed for fine-pitch semiconductor applications.

Q2: How does it keep the glue temperature consistent?
A: The CUF piezo jetting system works with a real-time closed-loop heater that keeps fluid-box and nozzle temperatures stable within ±2°C.

Q3: What if the glue runs low during operation?
A: The GS600 series uses triple-level alarms — weighing, capacitive sensing, and magnetic detection — to alert operators before glue runs out, avoiding process interruptions.

Q4: Can the GS600 series be integrated into an existing line?
A: Yes! The unit’s modular loading/unloading and SMEMA-compatible track design make integration into advanced packaging lines quick and cost-efficient.

About Mingseal

Mingseal is a trusted supplier of cutting-edge dispensing and jetting solutions for the global semiconductor, MEMS, and advanced electronics industries.
With decades of experience in high-precision glue application and process automation, Mingseal continues to help manufacturers push the limits of accuracy, repeatability, and cleanroom productivity.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.