High-Accuracy Dual-Valve Dam & Fill Dispenser for Wire Bonding
The GS600DD is an advanced dual-valve dispensing solution crafted
for the modern semiconductor packaging industry. Designed as a
robust cabinet-style floor-standing unit, this system provides
manufacturers with the flexibility, speed, and high accuracy
demanded by today’s PCBA and high-end semiconductor assembly lines.
This floor-standing system supports dual-valve synchronous interpolation and dual-valve asynchronous modes, so manufacturers can run two dispensing processes in
parallel or use different glue flow rates as needed. With a
universal cabinet-type structure, it is easy to maintain, simple to
upgrade, and can be redeployed across multiple workstations without
costly downtime.
Key Advantages
Flexible dual-valve design: Handle multiple glue tasks at once — faster production, more
efficient use of materials.
Automatic Maintenance: The built-in laser height sensor, residual glue cleaning cup, and
automatic low-level warning minimize downtime and help sustain high
OEE rates.
Flexible Materials: From solder paste and UV adhesives to conductive pastes, the
GS600DD supports diverse media for dam & fill, edge sealing, and
component encapsulation.
Stable Operation: FFU air purification, UPS backup, and real-time pressure
programming keep glue flow consistent, even during unexpected line
changes.
Application Fields
✓ FCBGA Coating Application
✓ Wire Bonding Coating Application
Core Modules
Double-Valve Synchronization (with Interpolation) Module
Automatic dispensing position correction separately for double
valves
Simultaneous operation of double valves to improve the production
efficiency
Piezoelectric Jetting System
Suitable for filling or coating of low-viscosity adhesives such as
Fill
Screw Dispensing System
Suitable for coating of high-viscosity adhesives such as Dam and
Tim
Glue Tank Scanning Module
Automatic reading of tank QR code information to prevent poor
operation caused by glue mixing / expired glue
Visual System
Positioning and detection functions
Inspection before operation to avoid defective incoming materials
Inspection after operation to prevent batch defects
Platform-Type Loading & Unloading System
Automatic sorting of feeding sequence
Completion of operation within Plasma time limit
Friendly human-machine interface design
FAQ
Q1: What makes the GS600DD suitable for dam & fill applications?
A: The dual-valve system allows the dam to be formed first with
precise edge control, followed by fill dispensing — both can be
fine-tuned for flow, height, and path accuracy.
Q2: Can the system handle different adhesive types?
A: Yes! From solder paste to UV-curable resins and conductive
adhesives, the GS600DD adapts easily with programmable pressure and
valve controls.
Q3: How does the system minimize glue waste or overflow?
A: Integrated laser sensors, machine vision, and real-time glue
path calculation help maintain tight glue volumes and avoid
spillover, crucial for BGA and fine-pitch areas.
About Mingseal
Mingseal is a trusted partner for global manufacturers seeking
next-level precision in dispensing, jetting, and coating processes.
From wafer-level underfill to high-end system-in-package bonding,
Mingseal continues to deliver innovative solutions that help
semiconductor producers achieve higher yields, lower defect rates,
and better ROI.
Explore more about our full portfolio at Mingseal
